SHENZHEN SINRI CO.,LTD

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产品简介

3D MID can be realized ※ Mounting for extreme versatility

Scalable to mount 3D MID

Strengthen substrate response capabilities

Flexible component / variety response

Extremely versatile switchability

※ 3D MID: 3D Molded Interconnect Device = Molded Interconnect Device

Basic specifications

	S10
Board size (when buffer function is not used)	L50 x W30mm to L1,330 x W510mm (standard L955)
(When using the inlet ｏｒ outlet buffer function)	From L50 x W30mm to L420 x W510mm
(When using the entrance and exit buffer function)	L50 x W30mm to L330 x W510mm
Substrate thickness	0.4〜4.8mm
Board transfer direction	Left to right (standard)
Substrate transfer speed	900mm / sec
Placement speed (12-axis placement head + 2θ) best conditions	0.08sec / CHIP (45,000CPH)
Mounting accuracy A (μ ＋ 3σ)	CHIP ±0.040mm
Placement accuracy B (μ ＋ 3σ)	IC ±0.025mm
Mounting angle	±180°
Z-axis control / θ-axis control	AC servo motor
Mountable component height	Up to 30mm * 1 (maximum height of components to be mounted is within 25mm)
Mountable components	0201 ～ 120 × 90mm BGA, CSP, connector, other special-shaped components (standard 0402 ～)
Component supply form	8 to 56mm tape (F1 / F2 feeder), 8 to 88mm tape (F3 electric feeder), lever feeder, tray
Determination of component being brought back	Negative pressure inspection and image inspection
Support multilingual screen	Japanese, Chinese, Korean, English
Substrate positioning	Clip-on substrate fixing unit, front side reference, automatic adjustment of transfer width
Number of feeders that can be installed	Up to 90 types (equivalent to 8mm tape) 45 units × 2
Substrate transfer height	900±20mm
Host size, weight	L1,250 x D1,750 x H1,420mm、approximately1,200 kg

* 1 Board thickness + component height = up to 30mm.